The preliminary memorandum of terms between the South Korean semiconductor manufacturer and the U.S. Department of Commerce will support high-bandwidth-memory AI chip production and advanced packaging R&D

WEST LAFAYETTE — The U.S. Department of Commerce announced Tuesday (Aug. 6) that it has agreed to a preliminary memorandum of terms with SK hynix to provide up to $450 million in direct funding, and an additional loan of up to $500 million to support high-bandwidth-memory (HBM) production and advanced packaging research and development for AI supply chain security in the U.S. The announcement also promises to create more than 800 new jobs in Indiana. 

SK hynix announced Wednesday (April 3) semiconductor advanced packaging investment in Purdue Research Park. From left to right: Mung Chiang, Purdue University president; Indiana Gov. Eric Holcomb; Kwak Noh-jung, SK hynix president and CEO; Woojin Choi, SK hynix executive vice president; Arati Prabhakar, director, White House Office of Science and Technology Policy, and assistant to the president for science and technology; U.S. Sen. Todd Young; Arun Venkataraman, U.S. Department of Commerce assistant secretary; Hyundong Cho, ambassador of the Republic of Korea to the United States; David Rosenberg, Indiana secretary of commerce; Mitch Daniels, Purdue Research Foundation chairman. (Purdue Research Foundation/Charles Jischke)

This comes on the heels of SK hynix’s April 2024 announcement that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D facility for AI products in the Purdue Research Park in West Lafayette. The new facility will be home to an advanced semiconductor packaging production line that will mass-produce next-generation HBM chips, the critical component of graphics processing units that train AI systems such as ChatGPT. The development of a critical link in the U.S. semiconductor supply chain next to Purdue’s campus marks another giant leap forward in the industry and the state. 

“We are excited about the Department of Commerce’s support, through the CHIPS and Science Act, of the largest semiconductor production facility located at a university in the U.S.,” Purdue President Mung Chiang said. “This facility will be transformational, as SK hynix leads globally in AI memory chips. And as the leading American university in this foundational technology, Purdue University is committed to co-creating jobs, workforce and innovation in our state and the Silicon Heartland.”

The next-generation chips will feature increased processing power and boast more advanced performance than the company’s latest HBM, which processes up to 1.18 terabytes of data—the equivalent of 230 full HD movies—per second.

U.S. Secretary of Commerce Gina Raimondo

“Today’s historic announcement with SK Hynix would further solidify America’s AI hardware supply chain in a way no other country on earth can match,” U.S. Secretary of Commerce Gina Raimondo said.

The HBM, which will be researched and developed, mass-produced, and packaged in this ecosystem with Purdue University, will play an important role in the U.S. semiconductor ecosystem and in advancing U.S. technological leadership.

SK hynix CEO Kwak Noh-Jung

“We are moving forward with the construction of the Indiana production base, working with the state of Indiana, Purdue University, and our U.S. business partners to supply leading-edge AI memory products from West Lafayette ultimately,” SK hynix CEO Kwak Noh-Jung said.

The U.S. now has all five major semiconductor manufacturers onshore, including SK Hynix in West Lafayette.

Investment in the Midwest and Indiana was spurred by Purdue’s excellence in discovery and innovation and its track record of exceptional R&D and talent development through collaboration.

Governor Eric Holcomb

“Indiana is a global leader in innovating and producing the products that will power our future economy. Today’s announcement supporting the planned work of SK hynix in West Lafayette is further proof that Indiana is a key player on both the national and economic security stages,” Indiana Gov. Eric Holcomb said. “I’m proud our SK hynix partnership answers the call for industry growth in America for decades to come. Indiana’s academic and government assets are perfectly aligned with the semiconductor industry mission, and this major announcement today not only underscores our state’s role in the hard-tech sector but is also another reminder that Indiana is a safe place to bet on the future. I’m grateful to so many of our valued partners, like Purdue University, especially Sen. Young, who’s been relentlessly effective in pursuing this investment.”

Managed by the Purdue Research Foundation, Purdue Research Park was chosen as SK hynix’s location as it unites discovery and delivery with easy access to Purdue faculty experts in the semiconductor field, highly sought-after graduates prepared to work in the industry, and vast Purdue research resources. The park, one of the country’s largest university-affiliated high-tech business incubation complexes, also offers convenient accessibility for the workforce and semi-truck traffic, with access to I-65 just minutes away.

Brian Edelman, Purdue Research Foundation president, said, “Semiconductors and microelectronics are at the forefront of focus for Purdue Research Foundation. I am pleased to foster an innovative ecosystem that high-tech companies moving into Indiana can trust to deliver excellence in all ways.”

Today’s news solidifies Indiana as a semiconductor industry leader and Purdue University as a valued partner for innovative high-tech companies like SK hynix and its supply chain partners.